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a flip-chip orientation

French translation: orientation à puces retournées

GLOSSARY ENTRY (DERIVED FROM QUESTION BELOW)
English term or phrase:a flip-chip orientation
French translation:orientation à puces retournées
Entered by: FX Fraipont (X)

10:19 Oct 31, 2014
English to French translations [PRO]
Tech/Engineering - Patents / light emitting diode with porous sic substrate and method for fabricating
English term or phrase: a flip-chip orientation
The LED 52 is arranged in the package 5 0 in a flip-chip orientation with the substrate 54 being the LED's primary emission surface.

The LED 52 is flip-chip mounted on first and second metal layer 58a, 58b.

The substrate 54 comprises a porous layer 55 that, in the flip-chip arrangement of the LED 52 is the top and primary emission surface of the LED 52.

When the flip-chip arranged LED is emitting, light reaches the primary emitting substrate surface at many different angles. Typical substrate semiconductor materials have a high index of refraction compared to ambient air or encapsulating epoxy.
bout2chou
Tunisia
orientation à puces retournées
Explanation:
"flip-chip" rather than "flip-flop"

" LIGHT EMITTING DIODE WITH POROUS SiC SUBSTRATE AND METHOD FOR FABRICATING
The emitter of claim 3, wherein said substrate and its emission region are mounted in a flip-chip orientation with said surface of said substrate having said porous layer as the primary emitting surface of said emitter."
http://www.google.com.ar/patents/WO2005034254A1?cl=en
Selected response from:

FX Fraipont (X)
Belgium
Local time: 15:57
Grading comment
4 KudoZ points were awarded for this answer



Summary of answers provided
4 +1orientation à puces retournées
FX Fraipont (X)
5orientation planaire
Marcombes (X)


Discussion entries: 1





  

Answers


2 mins   confidence: Answerer confidence 4/5Answerer confidence 4/5 peer agreement (net): +1
a flip-flop orientation
orientation à puces retournées


Explanation:
"flip-chip" rather than "flip-flop"

" LIGHT EMITTING DIODE WITH POROUS SiC SUBSTRATE AND METHOD FOR FABRICATING
The emitter of claim 3, wherein said substrate and its emission region are mounted in a flip-chip orientation with said surface of said substrate having said porous layer as the primary emitting surface of said emitter."
http://www.google.com.ar/patents/WO2005034254A1?cl=en

FX Fraipont (X)
Belgium
Local time: 15:57
Native speaker of: Native in FrenchFrench
PRO pts in category: 652

Peer comments on this answer (and responses from the answerer)
agree  Tony M: I think it's better to avoid an anglicism!
1 hr
  -> Thanks!
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1 day 4 hrs   confidence: Answerer confidence 5/5
orientation planaire


Explanation:
7 mars 2006 - 1.4.7.2 Flip-chip technology . ...... Une orientation actuelle est l'intégration en 3 dimensions (3D-MCM) [3] des .... de façon discrète et planaire.

Marcombes (X)
France
Local time: 15:57
Specializes in field
Native speaker of: Native in FrenchFrench
PRO pts in category: 94
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